Inventor

Kwang-chul Choi

Inventor

Suwon-si, KR

Overview

16→

Patents

2013–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H01LSemiconductor devices26%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%

A01GHorticulture4%

B05BSpraying apparatus4%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

H10DInorganic electric semiconductor devices2%

H10HInorganic light-emitting semiconductor devices having potential barriers2%

PatentTitleYear

9,875,918Initiator and method for debonding wafer supporting system2018 9,595,446'Methods of processing substrates'2017 9,589,947'Semiconductor packages and methods of manufacturing the same'2017 9,412,636'Methods for processing substrates'2016 9,202,767'Semiconductor device and method of manufacturing the same'2015 9,196,505'Semiconductor device and method of forming the same'2015 9,159,659'Semiconductor package and method of manufacturing the semiconductor package'2015 9,099,541'Method of manufacturing semiconductor device'2015 9,059,072'Semiconductor packages and methods of fabricating the same'2015 9,023,716'Methods for processing substrates'2015 9,006,081'Methods of processing substrates'2015 8,890,325'Heterojunction structures of different substrates joined and methods of fabricating the same'2014 8,816,509'Semiconductor package including underfill layers'2014 8,791,562'Stack package and semiconductor package including the same'2014 8,759,147'Semiconductor packages and methods of fabricating the same'2014 8,450,856'Semiconductor device and method of forming the same'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2018Patents assigned to SAMSUNG ELECTRONICS CO LTD (16)· patent assignee history

2013–2015Patents assigned to CHOI KWANG-CHUL (7)· patent assignee history

2013–2015Patents assigned to KIM JUNG-HWAN (6)· patent assignee history

2013–2015Patents assigned to MIN TAE HONG (5)· patent assignee history

2013–2018Based in Suwon-si, KR· patent location history

2014–2015Patents assigned to CHOI EUN-KYOUNG (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SAMSUNG ELECTRONICS CO LTD	16	2013–2018
CHOI KWANG-CHULself	7	2013–2015
KIM JUNG-HWAN	6	2013–2015
MIN TAE HONG	5	2013–2015
CHOI EUN-KYOUNG	3	2014–2015

Locations

Location	Patents	Span
Suwon-si, KR	16	2013–2018