Inventor
Ki-Chul Park
Inventor
Suwon-si, KR
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H10DInorganic electric semiconductor devices13%
H04LTransmission of digital information, e.g. telegraphic communication9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
F01NGas-flow silencers or exhaust apparatus for machines or engines in general8%
G06FElectric digital data processing7%
G01RMeasuring electric variables6%
H04NPictorial communication, e.g. television4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
H04WWireless communication networks2%
PatentTitleYear
10,680,844Apparatus and method for providing information for a wireless network connection using Wi-Fi202010,403,640Semiconductor devices including insulating capping structures201910,397,760User terminal device and method for providing web service thereof201910,208,639Structure of muffler20199,912,491'System and method for displaying document content using UPnP'20189,667,487'Method and apparatus for changing input type in input system using universal plug and play'20179,646,776'On-off lever of disconnecting switch for power distribution line'20179,371,753'System of controlling exhaust sound of vehicle automatically and method of the same'20169,015,383'Method and apparatus for changing input type in input system using universal plug and play'20158,943,545'Digital living network alliance system and method for providing content therein'20158,910,471'Structure of exhaust pipe for exhaust heat recovery'20148,905,188'Muffler for motor vehicle'20148,875,836'Tail pipe for muffler of motor vehicle'20148,756,303'Method and apparatus for determining object updates in a home network'20148,697,568'Semiconductor chip including a plurality of chip areas and fabricating method thereof'20148,684,131'Dual muffler'20148,528,693'Muffler with dual exhaust gas discharge pipe for vehicle'20138,510,396'Apparatus and method for storing content flip list of digital media server using user input feedback'20137,951,712'Interconnections having double capping layer and method for forming the same'20117,928,002'Method of forming wiring layer of semiconductor device'20117,605,472'Interconnections having double capping layer and method for forming the same'20097,586,175'Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface'20097,514,354'Methods for forming damascene wiring structures having line and plug conductors formed from different materials'20097,462,507'Structure of a CMOS image sensor and method for fabricating the same'20087,400,003'Structure of a CMOS image sensor and method for fabricating the same'20087,365,025'Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics'20087,335,590'Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby'20087,332,764'Metal-insulator-metal (MIM) capacitor and method of fabricating the same'20087,205,666'Interconnections having double capping layer and method for forming the same'20077,037,835'Interconnections having double capping layer and method for forming the same'20066,884,710'Semiconductor device having multi-layer copper line and method of forming same'20056,861,686'Structure of a CMOS image sensor and method for fabricating the same'20056,842,028'Apparatus for testing reliability of interconnection in integrated circuit'20056,693,446'Apparatus for testing reliability of interconnection in integrated circuit'20046,690,187'Apparatus for testing reliability of interconnection in integrated circuit'20046,548,905'Semiconductor device having multi-layer copper line and method of forming the same'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (27)· patent assignee history
2003–2005Based in Seoul, KR· patent location history
2005–2008Based in Kyungki-do, KR· patent location history
2006–2020Based in Suwon-si, KR· patent location history
2013–2019Patents assigned to HYUNDAI MOTOR CO LTD (6)· patent assignee history
2013–2015Patents assigned to PARK KI-CHUL (4)· patent assignee history
2013–2015Patents assigned to HWANG TAE-HWAN (3)· patent assignee history
2013–2015Patents assigned to LIM BYUNG-SOO (3)· patent assignee history
2013–2018Based in Gyeonggi-do, KR· patent location history
2019Based in Hwaseong-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 27 | 2003–2020 |
| HYUNDAI MOTOR CO LTD | 6 | 2013–2019 |
| PARK KI-CHULself | 4 | 2013–2015 |
| HWANG TAE-HWAN | 3 | 2013–2015 |
| LIM BYUNG-SOO | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 16 | 2006–2020 |
| Gyeonggi-do, KR | 7 | 2013–2018 |
| Seoul, KR | 5 | 2003–2005 |
| Kyungki-do, KR | 3 | 2005–2008 |
| Hwaseong-si, KR | 1 | 2019 |