Inventor
Yi-Chuan Teng
Inventor
Zhubei City, TW
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems21%
B81BMicrostructural devices or systems, e.g. micromechanical devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H10DInorganic electric semiconductor devices4%
H10NElectric solid-state devices not otherwise provided for3%
H01GCapacitors2%
B08BCleaning in general1%
B23KSoldering or unsoldering1%
PatentTitleYear
11,117,796MEMS devices including MEMS dies and connectors thereto202111,107,630Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device202110,961,114Semiconductor structure and manufacturing method for the same202110,861,929Electronic device including a capacitor202010,710,871MEMS devices including MEMS dies and connectors thereto202010,526,196Structure and formation method of semiconductor device structure202010,508,023MEMS devices including MEMS dies and connectors thereto201910,155,659Vacuum sealed MEMS and CMOS package20189,919,914'MEMS devices including MEMS dies and connectors thereto'20189,776,856'Vacuum sealed MEMS and CMOS package'20179,673,169'Method and apparatus for a wafer seal ring'20179,656,852'CMOS-MEMS device structure, bonding mesa structure and associated method'20179,617,143'Semiconductor device'20179,567,208'Semiconductor device and method for fabricating the same'20179,545,691'Method of removing waste of substrate and waste removing device thereof'20179,469,524'Semiconductor device with through molding vias and method of making the same'20169,352,956'MEMS devices and methods for forming same'20169,269,679'Wafer level packaging techniques'20169,238,578'Semiconductor arrangement with stress release and thermal insulation'20169,150,404'Semiconductor device with through molding vias'20159,130,531'Semiconductor arrangement with thermal insulation configuration'20159,114,976'Semiconductor arrangement with stress release configuration'20158,941,152'Semiconductor device'20158,841,201'Systems and methods for post-bonding wafer edge seal'20148,686,571'Bonding layer structure and method for wafer to wafer bonding'20146,349,142'Structure of speaker use on ship'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Based in Taipei, TW· patent location history
2014–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (8)· patent assignee history
2014Patents assigned to CHO CHIN-YI (1)· patent assignee history
2014Patents assigned to HUANG HSIN-TING (1)· patent assignee history
2014Patents assigned to HUANG YAO-TE (1)· patent assignee history
2014–2020Based in Zhubei City, TW· patent location history
2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history
2017–2021Based in Hsinchu County, TW· patent location history
2021Based in Zhubei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 17 | 2016–2021 |
| TAIWAN SEMICONDUCTOR MFG | 8 | 2014–2016 |
| CHO CHIN-YI | 1 | 2014 |
| HUANG HSIN-TING | 1 | 2014 |
| HUANG YAO-TE | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Zhubei City, TW | 19 | 2014–2020 |
| Hsinchu County, TW | 4 | 2017–2021 |
| Zhubei, TW | 2 | 2021 |
| Taipei, TW | 1 | 2002 |