Inventor
Takeshi Kawana
Inventor
Yokohama, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification33%
H05KPrinted circuits20%
B23KSoldering or unsoldering13%
H02KDynamo-electric machines13%
B29CShaping or joining of plastics7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
5,371,931'Production system for molded and pressed parts'19944,950,866'Method and apparatus of bonding insulated and coated wire'19904,620,663'Parts-connecting apparatus using solder'19864,586,247'Apparatus for inserting electronic elements'19864,571,822'Apparatus for inserting coils into stator core slots'19864,543,708'Method of manufacturing an armature'19854,312,109'Apparatus for inserting electronic elements'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1982–1994Patents assigned to HITACHI LTD (7)· patent assignee history
1982–1994Based in Yokohama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 7 | 1982–1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 7 | 1982–1994 |