Inventor
DANIEL PORWOL
Inventor
DE
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1038%
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form13%
PatentTitleYear
12,112,992Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component202411,605,572Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer202311,279,120Device and method for debonding a structure from a main surface region of a carrier2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INFINEON TECHNOLOGIES AG (3)· patent assignee history
2022–2024Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 3 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 3 | 2022–2024 |