Inventor
CHENG-PING CHEN
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing31%
H01LSemiconductor devices19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
B24DTools for grinding, buffing or sharpening8%
B29CShaping or joining of plastics8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B08BCleaning in general4%
F16LPipes4%
PatentTitleYear
12,427,622Polishing pad conditioning apparatus202512,311,498Monolithic platen202512,237,179Fittings for wafer cleaning systems202511,975,421Single bodied platen housing a detection module for CMP systems202411,919,126Monolithic platen202411,850,702Chemical mechanical planarization membrane202311,618,126Polishing pad conditioning apparatus202311,571,782Single bodied platen housing a detection module for CMP systems202311,267,099Chemical mechanical planarization membrane2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2025 |