Inventor
SANGUK HAN
Inventor
KR
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
G01RMeasuring electric variables7%
H05KPrinted circuits7%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
G09GArrangements or circuits for control of indicating devices using static means to present variable information4%
PatentTitleYear
12,230,576Chip-on-film package and display apparatus including the same202512,148,337Chip on film package with trench to reduce slippage and display device including the same202412,087,696Semiconductor package202411,923,342Semiconductor package202411,869,818Chip-stacked semiconductor package and method of manufacturing same202411,842,945Chip on film package and display apparatus including the same202311,574,873Semiconductor package202311,444,060Semiconductor package202211,328,966Chip-stacked semiconductor package and method of manufacturing same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (9)· patent assignee history
2022–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 9 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 9 | 2022–2025 |