Inventor
TAKAO SAKAMOTO
Inventor
JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
F16Fprimary
F16FSprings19%
F16HGearing19%
A61KPreparations for medical, dental or toiletry purposes13%
A61QSpecific use of cosmetics or similar toiletry preparations13%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds13%
C08LCompositions of macromolecular compounds6%
H01LSemiconductor devices6%
H10DInorganic electric semiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
11,887,845Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrate202411,771,632Skin- or hair-cleansing composition containing aqueous gelling agent, and methods for producing aqueous gelling agent and cleansing composition202311,668,369Vibration damping device and design method of the same202311,512,766Vibration damping apparatus202211,464,730Cosmetic composition containing aqueous gelling agent, and method for producing aqueous gelling agent and cosmetic composition202211,204,078Vibration damping device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to AISIN AW CO (1)· patent assignee history
2021–2024Based in JP· patent location history
2022–2023Patents assigned to ADEKA CORP (2)· patent assignee history
2022–2023Patents assigned to AISIN CORP (2)· patent assignee history
2024Patents assigned to GLOBALWAFERS JAPAN CO LTD (1)· patent assignee history
2024Patents assigned to UNIV TOHOKU (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADEKA CORP | 2 | 2022–2023 |
| AISIN CORP | 2 | 2022–2023 |
| AISIN AW CO | 1 | 2021 |
| GLOBALWAFERS JAPAN CO LTD | 1 | 2024 |
| UNIV TOHOKU | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 6 | 2021–2024 |