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Inventor

Roger D. Flynn

Inventor
Tempe, AZ, US

Overview

3→
Patents
2016–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing21%
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H05KPrinted circuits14%
Y10TTechnical subjects covered by former us classification14%
B23PMetal-working not otherwise provided for7%
PatentTitleYear
9,721,871'Heat exchanger methods, apparatuses and systems with a manifold structure'20179,646,910'Integrated heat spreader that maximizes heat transfer from a multi-chip package'20179,257,364'Integrated heat spreader that maximizes heat transfer from a multi-chip package'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016–2017Patents assigned to INTEL CORP (3)· patent assignee history
2016Patents assigned to AGARWAL RAJAT (1)· patent assignee history
2016Patents assigned to AHUJA SANDEEP (1)· patent assignee history
2016Patents assigned to BUDDRIUS ERIC W (1)· patent assignee history
2016Patents assigned to FLYNN ROGER D (1)· patent assignee history
2016–2017Based in Tempe, AZ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP32016–2017
AGARWAL RAJAT12016
AHUJA SANDEEP12016
BUDDRIUS ERIC W12016
FLYNN ROGER Dself12016
Locations
LocationPatentsSpan
Tempe, AZ, US32016–2017