Inventor

Masatsugu Ogata

Inventor

Hitachi, JP

Overview

1976–2005

Patent span

Electricity

Primary field (CPC H)

Patents· 36 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%

H05KPrinted circuits21%

H10DInorganic electric semiconductor devices19%

Y10TTechnical subjects covered by former us classification12%

C08LCompositions of macromolecular compounds5%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%

H01BCables3%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%

PatentTitleYear

6,919,622'Semiconductor device'2005 6,720,208'Semiconductor device'2004 6,632,881'Encapsulant of epoxy resin and liquid aromatic amine curing agent'2003 6,531,760'Semiconductor device'2003 6,326,681'Semiconductor device'2001 6,303,982'Semiconductor device'2001 6,204,552'Semiconductor device'2001 6,130,114'Semiconductor device'2000 6,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'2000 6,114,005'Laminate and multilayer printed circuit board'2000 6,100,115'Semiconductor device'2000 6,100,580'Semiconductor device having all outer leads extending from one side of a resin member'2000 6,081,023'Semiconductor device'2000 6,072,231'Semiconductor device'2000 6,069,029'Semiconductor device chip on lead and lead on chip manufacturing'2000 6,018,191'Semiconductor device'2000 5,981,315'Semiconductor device'1999 5,914,530'Semiconductor device'1999 5,863,817'Semiconductor device'1999 5,821,606'Semiconductor device'1998 5,793,099'Semiconductor device'1998 5,677,045'Laminate and multilayer printed circuit board'1997 5,612,569'Semiconductor device'1997 5,602,420'Stacked high mounting density semiconductor devices'1997 5,530,286'Semiconductor device'1996 5,358,904'Semiconductor device'1994 5,225,499'Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same'1993 5,181,097'Plastic molded type electronic device'1993 5,068,712'Semiconductor device'1991 4,965,657'Resin encapsulated semiconductor device'1990 4,393,177'Thermosetting resin composition, process for preparation thereof and cured product thereof'1983 4,387,311'Uninflammable dynamoelectric machine having coil windings and core encapsulated with unsaturated polyester resin-filler composition'1983 4,366,516'Precision machinery component'1982 4,352,897'Resin molded stators'1982 4,129,678'Self-bondable insulated wires comprising three coatings including a phenoxy resin outer layer'1978 3,947,395'Epoxy surface coating compositions'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–2001Patents assigned to HITACHI LTD (32)· patent assignee history

1976–2005Based in Hitachi, JP· patent location history

1990–2003Patents assigned to HITACHI CHEMICAL CO LTD (2)· patent assignee history

2003Based in Ibaraki, JP· patent location history

2004–2005Patents assigned to RENESAS TECH CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	32	1976–2001
HITACHI CHEMICAL CO LTD	2	1990–2003
RENESAS TECH CORP	2	2004–2005

Locations

Location	Patents	Span
Hitachi, JP	35	1976–2005
Ibaraki, JP	1	2003