Inventor
Rajesh Vaddi
Inventor
US
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
C03CChemical composition of glasses, glazes or vitreous enamels12%
C23CCoating metallic material8%
H10HInorganic light-emitting semiconductor devices having potential barriers7%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
H05KPrinted circuits5%
Y10TTechnical subjects covered by former us classification5%
G09FDisplaying3%
PatentTitleYear
12,131,985Hermetic metallized via with improved reliability202412,046,481Systems and methods for reducing via formation impact on electronic device formation202412,013,619Methods for forming thin film transistors on a glass substrate and liquid crystal displays formed therefrom202411,777,067Bezel-free display tile with edge-wrapped conductors and methods of manufacture202311,756,847Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer202311,654,657Through glass via fabrication using a protective material202311,456,225Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer202211,329,228Polar elastomer microstructures and methods for fabricating same202211,282,994Bezel-free display tile with edge-wrapped conductors and methods of manufacture202211,257,728Fluidic assembly substrates and methods for making such202211,201,109Hermetic metallized via with improved reliability202111,152,294Hermetic metallized via with improved reliability2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to CORNING INC (12)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CORNING INC | 12 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 12 | 2021–2024 |