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Inventor

Osamu Munekata

Inventor
Souka, JP

Overview

8→
Patents
2000–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 8 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering36%
C22CAlloys23%
H05KPrinted circuits23%
H01LSemiconductor devices5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
Y02PClimate change mitigation technologies in the production or processing of goods5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
10,780,531Solder ball, solder joint, and joining method20208,216,395'Lead-free solder alloy'20127,682,468'Lead-free solder alloy'20107,628,308'Method of replenishing an oxidation suppressing element in a solder bath'20097,338,567'Lead-free solder alloy'20087,029,542'Lead-free solder alloy'20066,554,180'Lead-free solder paste'20036,050,480'Solder paste for chip components'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2020Patents assigned to SENJU METAL INDUSTRY CO (8)· patent assignee history
2000–2003Based in Koshigaya, JP· patent location history
2006–2010Based in Souka, JP· patent location history
2009Patents assigned to MATUSHITA ELECTRIC IND CO LTD (1)· patent assignee history
2012Patents assigned to MUNEKATA OSAMU (1)· patent assignee history
2012Patents assigned to OHNISHI TSUKASA (1)· patent assignee history
2012Patents assigned to TOYODA YOSHITAKA (1)· patent assignee history
2012–2020Based in Tochigi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENJU METAL INDUSTRY CO82000–2020
MATUSHITA ELECTRIC IND CO LTD12009
MUNEKATA OSAMUself12012
OHNISHI TSUKASA12012
TOYODA YOSHITAKA12012
Locations
LocationPatentsSpan
Souka, JP42006–2010
Tochigi, JP22012–2020
Koshigaya, JP22000–2003