Inventor
Hisao Iwase
Inventor
Aichi, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing50%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling10%
B24DTools for grinding, buffing or sharpening10%
B82YSpecific uses or applications of nanostructures10%
PatentTitleYear
8,377,159'Synthetic grinding stone'20137,997,953'Precision machining method'20117,950,981'Precision machining apparatus and precision machining method'20117,247,081'Precision machining apparatus and precision machining method'20077,160,175'Attitude control device and precision machining apparatus'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2011Patents assigned to TOYOTA MOTOR CO LTD (3)· patent assignee history
2007–2011Based in Aichi, JP· patent location history
2013Patents assigned to EDA HIROSHI (1)· patent assignee history
2013Patents assigned to IWASE HISAO (1)· patent assignee history
2013Patents assigned to KAMIYA SUMIO (1)· patent assignee history
2013Patents assigned to KENMOCHI MASAAKI (1)· patent assignee history
2013Based in Toyota, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYOTA MOTOR CO LTD | 3 | 2007–2011 |
| EDA HIROSHI | 1 | 2013 |
| IWASE HISAOself | 1 | 2013 |
| KAMIYA SUMIO | 1 | 2013 |
| KENMOCHI MASAAKI | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Aichi, JP | 4 | 2007–2011 |
| Toyota, JP | 1 | 2013 |