Inventor
Chan Lam Cha
Inventor
MY
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
B81BMicrostructural devices or systems, e.g. micromechanical devices7%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure7%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers7%
PatentTitleYear
12,300,559Semiconductor packages and methods for manufacturing thereof202512,278,171Chip package and method of forming a chip package202512,176,222Semiconductor package with metal posts from structured leadframe202411,469,161Lead frame-based semiconductor package202211,274,984Pressure sensor having a lidless/laminate structure202211,217,511Quad package with conductive clips connected to terminals at upper surface of semiconductor die2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INFINEON TECHNOLOGIES AG (6)· patent assignee history
2022–2025Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 6 | 2022–2025 |