Inventor

Dai Nakajima

Inventor

Tokyo, JP

Overview

2001–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 38 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%

H02KDynamo-electric machines13%

H01LSemiconductor devices11%

H05KPrinted circuits8%

H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems6%

H02PControl or regulation of electric motors, electric generators or dynamo-electric converters5%

G01NInvestigating or analysing materials by determining their chemical or physical properties3%

H01RElectrically-conductive connections3%

H10DInorganic electric semiconductor devices3%

H01GCapacitors2%

PatentTitleYear

11,107,745Semiconductor device and method for manufacturing the same2021 10,775,329Thermal conductivity measurement device and thermal conductivity measurement method2020 10,768,127Thermal conductivity measurement apparatus and thermal conductivity measurement method2020 10,727,167Power semiconductor device and method for manufacturing power semiconductor device2020 10,529,643Semiconductor device and method of manufacturing the same2020 10,461,010Power module, power semiconductor device and power module manufacturing method2019 10,348,150Rotating electric machine stator2019 9,892,992'Swaged heat sink and heat sink integrated power module'2018 9,812,929'Electric rotating machine'2017 9,698,646'Rotating electrical machine'2017 9,653,969'Brush structure with heat dissipation member'2017 9,620,444'Power semiconductor device'2017 9,577,495'Rotary electric machine'2017 9,531,318'Rotating electrical machine'2016 9,479,029'Electric rotating machine'2016 9,236,324'Electric power semiconductor device and method for producing same'2016 9,129,949'Power semiconductor module'2015 8,461,733'Power supply unit-integrated dynamoelectric machine'2013 8,299,666'Control apparatus-integrated dynamoelectric machine'2012 7,560,809'Semiconductor device'2009 7,151,661'Capacitor module and semiconductor device using the same'2006 7,151,311'Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer'2006 7,081,671'Power module'2006 6,984,884'Electric power semiconductor device'2006 6,979,843'Power semiconductor device'2005 6,940,164'Power module'2005 6,903,457'Power semiconductor device'2005 6,900,986'Power module'2005 6,867,484'Semiconductor device'2005 6,791,819'Capacitor module and semiconductor device using the same'2004 6,787,893'Semiconductor device'2004 6,762,937'Power module'2004 6,753,596'Resin-sealed semiconductor device'2004 6,700,194'Semiconductor device'2004 6,580,147'Semiconductor device having built-in capacitors'2003 6,522,544'Power module'2003 6,501,172'Power module'2002 6,304,448'Power module'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2020Patents assigned to MITSUBISHI ELECTRIC CORP (33)· patent assignee history

2001–2021Based in Tokyo, JP· patent location history

2012–2017Patents assigned to NAKAJIMA DAI (11)· patent assignee history

2012–2017Patents assigned to FUJITA MASAHIKO (9)· patent assignee history

2012–2020Based in Chiyoda-ku, JP· patent location history

2013–2017Patents assigned to ISODA HITOSHI (4)· patent assignee history

2016–2017Patents assigned to FUKASE TATSUYA (4)· patent assignee history

2019Based in Anjo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MITSUBISHI ELECTRIC CORP	33	2001–2020
NAKAJIMA DAIself	11	2012–2017
FUJITA MASAHIKO	9	2012–2017
FUKASE TATSUYA	4	2016–2017
ISODA HITOSHI	4	2013–2017

Locations

Location	Patents	Span
Tokyo, JP	27	2001–2021
Chiyoda-ku, JP	10	2012–2020
Anjo, JP	1	2019