Inventor

Kelvin Ming Wai Ng

Inventor

Kowloon, HK

Overview

2005

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary

B23KSoldering or unsoldering50%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2005Patents assigned to ASM ASSEMBLY AUTOMATION LTD (1)· patent assignee history

2005Based in Kowloon, HK· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ASM ASSEMBLY AUTOMATION LTD	1	2005

Locations

Location	Patents	Span
Kowloon, HK	1	2005