Inventor
BRANDON M. RAWLINGS
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H10DInorganic electric semiconductor devices12%
B81BMicrostructural devices or systems, e.g. micromechanical devices8%
H01FMagnets8%
H01GCapacitors8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B82YSpecific uses or applications of nanostructures4%
H01PWaveguides4%
H01QAntennas, i.e. radio aerials4%
PatentTitleYear
12,550,768Conformal power delivery structures near high-speed signal traces202612,183,961Methods for conductively coating millimeter waveguides202412,002,745High performance integrated RF passives using dual lithography process202411,749,628Sacrificial redistribution layer in microelectronic assemblies having direct bonding202311,527,501Sacrificial redistribution layer in microelectronic assemblies having direct bonding202211,227,825High performance integrated RF passives using dual lithography process2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (6)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2026 |