Inventor
Alexander Veytser
Inventor
Mountain View, CA, US
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
Y10TTechnical subjects covered by former us classification13%
B23KSoldering or unsoldering10%
C04BLime, magnesia9%
H01LSemiconductor devices7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges6%
C23CCoating metallic material6%
H05BElectric heating6%
H01JElectric discharge tubes or discharge lamps5%
PatentTitleYear
11,091,397Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices202110,991,616High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same202110,646,941Method for manufacture of a multi-layer plate device202010,287,215Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices201910,213,858Multi-layer plate device201910,153,183High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same20189,999,947Method for repairing heaters and chucks used in semiconductor processing20189,984,866Multiple zone heater20189,624,137'Low temperature method for hermetically joining non-diffusing ceramic materials'20179,556,074'Method for manufacture of a multi-layer plate device'20179,315,424'Multi-layer plate device'20168,932,690'Plate and shaft device'20158,789,743'Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials'20147,098,428'System and method for an improved susceptor'20066,721,162'Electrostatic chuck having composite dielectric layer and method of manufacture'20046,583,980'Substrate support tolerant to thermal expansion stresses'20036,538,872'Electrostatic chuck having heater and method'20036,503,368'Substrate support having bonded sections and method'20036,494,958'Plasma chamber support with coupled electrode'20026,490,146'Electrostatic chuck bonded to base with a bond layer and method'20026,478,924'Plasma chamber support having dual electrodes'20026,462,928'Electrostatic chuck having improved electrical connector and method'20026,414,834'Dielectric covered electrostatic chuck'20026,310,755'Electrostatic chuck having gas cavity and method'20016,151,203'Connectors for an electrostatic chuck and combination thereof'20006,108,189'Electrostatic chuck having improved gas conduits'20006,094,334'Polymer chuck with heater and method of manufacture'20005,885,469'Topographical structure of an electrostatic chuck and method of fabricating same'19995,801,915'Electrostatic chuck having a unidirectionally conducting coupler layer'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2004Patents assigned to APPLIED MATERIALS INC (15)· patent assignee history
1998–2021Based in Mountain View, CA, US· patent location history
2000Based in Mountainview, CA, US· patent location history
2006–2015Patents assigned to BALMA FRANK (2)· patent assignee history
2014–2016Patents assigned to COMPONENT RE ENGINEERING COMPANY INC (3)· patent assignee history
2017Patents assigned to COMPONENT RE-ENGINEERING COMPANY INC (2)· patent assignee history
2018–2021Patents assigned to COMPONENT RE ENG COMPANY INC (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 15 | 1998–2004 |
| COMPONENT RE ENG COMPANY INC | 7 | 2018–2021 |
| COMPONENT RE ENGINEERING COMPANY INC | 3 | 2014–2016 |
| BALMA FRANK | 2 | 2006–2015 |
| COMPONENT RE-ENGINEERING COMPANY INC | 2 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mountain View, California, US | 28 | 1998–2021 |
| Mountainview, California, US | 1 | 2000 |