Inventor

Edward Fuergut

Inventor

Dasing, DE

Overview

2006–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 113 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%

H01LSemiconductor devices20%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

H10DInorganic electric semiconductor devices6%

H05KPrinted circuits3%

B81BMicrostructural devices or systems, e.g. micromechanical devices2%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%

B29CShaping or joining of plastics2%

H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers1%

Y02PClimate change mitigation technologies in the production or processing of goods1%

PatentTitleYear

11,049,790Electrically insulating thermal interface on the discontinuity of an encapsulation structure2021 11,040,872Semiconductor module2021 10,916,515Systems and methods using an RF circuit on isolating material2021 10,734,250Method of manufacturing a package having a power semiconductor chip2020 10,685,909Power package having multiple mold compounds2020 10,573,533Method of reducing a sheet resistance in an electronic device, and an electronic device2020 10,483,133Method for fabricating a semiconductor chip panel2019 10,435,292Method for producing a semiconductor module2019 10,418,313Electronic module comprising a plurality of encapsulation layers and a method for producing it2019 10,373,895Semiconductor device having die pads with exposed surfaces2019 10,373,897Semiconductor devices with improved thermal and electrical performance2019 10,361,138Method for manufacturing an arrangement including a chip carrier notch2019 10,347,554Spatially selective roughening of encapsulant to promote adhesion with functional structure2019 10,256,119Method of manufacturing a semiconductor power package2019 10,177,112Attaching chip attach medium to already encapsulated electronic chip2019 10,125,012MEMS device2018 10,121,690Method of manufacturing a semiconductor component and semiconductor component2018 10,115,646Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement2018 10,096,584Method for producing a power semiconductor module2018 10,049,962Arrangement of multiple power semiconductor chips and method of manufacturing the same2018 10,043,782Electronic device package having a dielectric layer and an encapsulant2018 10,037,972Electronic module comprising fluid cooling channel and method of manufacturing the same2018 10,020,285Method of producing a semiconductor device and a semiconductor device2018 9,984,928Method for producing a number of chip assemblies and method for producing a semiconductor arrangement2018 9,979,187Power device with overvoltage arrester2018 9,966,277Arrangement and method for manufacturing the same2018 9,953,846Method for fabricating a semiconductor chip panel2018 9,922,910'Functionalized interface structure'2018 9,837,288Semiconductor power package and method of manufacturing the same2017 9,768,037'Electronic device package including metal blocks'2017 9,698,070'Arrangement having a plurality of chips and a chip carrier, and a processing arrangement'2017 9,666,499'Semiconductor device with encapsulant'2017 9,627,287'Thinning in package using separation structure as stop'2017 9,595,502'Spring contact for semiconductor chip'2017 9,593,009'Apparatus comprising and a method for manufacturing an embedded MEMS device'2017 9,589,859'Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement'2017 9,584,889'System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille'2017 9,496,228'Integrated circuit and method of manufacturing an integrated circuit'2016 9,455,160'Method for fabricating a semiconductor chip panel'2016 9,437,513'Electrically insulating thermal interface on the discontinuity of an encapsulation structure'2016 9,412,626'Method for manufacturing a chip arrangement'2016 9,395,404'Method for testing semiconductor chips or semiconductor chip modules'2016 9,355,881'Semiconductor device including a dielectric material'2016 9,349,680'Chip arrangement and method of manufacturing the same'2016 9,318,473'Semiconductor device including a polymer disposed on a carrier'2016 9,275,916'Removable indicator structure in electronic chips of a common substrate for process adjustment'2016 9,230,894'Methods for manufacturing a chip package'2016 9,196,568'Arrangement and method for manufacturing the same'2015 9,184,066'Chip arrangements and methods for manufacturing a chip arrangement'2015 9,171,804'Method for fabricating an electronic component'2015 9,129,959'Method for manufacturing an electronic module and an electronic module'2015 9,123,806'Method of manufacturing a semiconductor device'2015 9,082,767'Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package'2015 9,064,869'Semiconductor module and a method for fabrication thereof by extended embedding technologies'2015 9,040,346'Semiconductor package and methods of formation thereof'2015 9,041,226'Chip arrangement and a method of manufacturing a chip arrangement'2015 8,901,739'Embedded chip package, a chip package, and a method for manufacturing an embedded chip package'2014 8,872,288'Apparatus comprising and a method for manufacturing an embedded MEMS device'2014 8,815,651'Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier'2014 8,786,111'Semiconductor packages and methods of formation thereof'2014 8,778,733'Semiconductor package and methods of formation thereof'2014 8,749,029'Method of manufacturing a semiconductor device'2014 8,728,873'Methods for filling a contact hole in a chip package arrangement and chip package arrangements'2014 8,692,361'Electric device package comprising a laminate and method of making an electric device package comprising a laminate'2014 8,648,456'Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package'2014 8,580,070'Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer'2013 8,574,966'Semiconductor device having a semiconductor chip, and method for the production thereof'2013 8,524,542'Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same'2013 8,450,148'Molding compound adhesion for map-molded flip-chip'2013 8,431,063'Heat treatment for a panel and apparatus for carrying out the heat treatment method'2013 8,394,308'Mold method'2013 8,288,207'Method of manufacturing semiconductor devices'2012 8,247,897'Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same'2012 8,168,472'Semiconductor device having a semiconductor chip, and method for the production thereof'2012 8,158,046'Mold apparatus and method'2012 8,148,210'Method for fabricating a semiconductor chip panel'2012 8,062,928'Semiconductor device having a semiconductor chip, and method for the production thereof'2011 7,994,646'Semiconductor device'2011 7,968,378'Electronic device'2011 7,944,061'Semiconductor device having through contacts through a plastic housing composition and method for the production thereof'2011 7,943,423'Reconfigured wafer alignment'2011 7,935,622'Support with solder ball elements and a method for populating substrates with solder balls'2011 7,932,180'Manufacturing a semiconductor device via etching a semiconductor chip to a first layer'2011 7,923,350'Method of manufacturing a semiconductor device including etching to etch stop regions'2011 7,915,089'Encapsulation method'2011 7,893,532'External contact material for external contacts of a semiconductor device and method of making the same'2011 7,883,993'Semiconductor device with semiconductor chip and rewiring layer and method for producing the same'2011 7,843,055'Semiconductor device having an adhesion promoting layer and method for producing it'2010 7,830,026'Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip'2010 7,800,241'Semiconductor device with semiconductor device components embedded in a plastics composition'2010 7,795,742'Semiconductor device having a semiconductor chip, and method for the production thereof'2010 7,767,495'Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material'2010 7,759,805'Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles'2010 7,732,242'Composite board with semiconductor chips and plastic housing composition and method'2010 7,713,791'Panel and semiconductor device having a composite plate with semiconductor chips'2010 7,709,379'Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof'2010 7,700,956'Sensor component and panel used for the production thereof'2010 7,674,654'Producing thin integrated semiconductor devices'2010 7,663,218'Integrated circuit component with a surface-mount housing'2010 7,622,733'Semiconductor structure with a plastic housing and separable carrier plate'2009 7,585,701'Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film'2009 7,575,173'Smart card, smart card module, and a method for production of a smart card module'2009 7,545,047'Semiconductor device with a wiring substrate and method for producing the same'2009 7,528,054'Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips'2009 7,524,699'Electronic component and a panel'2009 7,485,493'Singulating surface-mountable semiconductor devices and fitting external contacts to said devices'2009 7,481,641'Apparatus and method for producing an article by means of a molding technique'2009 7,482,198'Method for producing through-contacts and a semiconductor component with through-contacts'2009 7,429,782'Semiconductor stack block comprising semiconductor chips and methods for producing the same'2008 7,408,241'Semiconductor device with a recessed bond pad'2008 7,391,103'Electronic module having plug contacts and method for producing it'2008 7,202,107'Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method'2007 7,091,595'Semiconductor device with semiconductor chip and rewiring layer and method for producing the same'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2021Patents assigned to INFINEON TECHNOLOGIES AG (99)· patent assignee history

2006–2021Based in Dasing, DE· patent location history

2010Based in Ligusterweg, DE· patent location history

2011–2016Patents assigned to FUERGUT EDWARD (24)· patent assignee history

2012–2016Patents assigned to MAHLER JOACHIM (10)· patent assignee history

2012–2013Patents assigned to BRUNNBAUER MARKUS (5)· patent assignee history

2017–2020Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (9)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INFINEON TECHNOLOGIES AG	99	2006–2021
FUERGUT EDWARDself	24	2011–2016
MAHLER JOACHIM	10	2012–2016
INFINEON TECHNOLOGIES AUSTRIA AG	9	2017–2020
BRUNNBAUER MARKUS	5	2012–2013

Locations

Location	Patents	Span
Dasing, DE	112	2006–2021
Ligusterweg, DE	1	2010