Inventor
Dan HE
Inventor
CN
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Bprimary
B23BTurning20%
C23CCoating metallic material20%
B23CMilling15%
G16BBioinformatics, i.e. information and communication technology [ict] specially adapted for genetic or protein-related data processing in computational molecular biology10%
H04LTransmission of digital information, e.g. telegraphic communication10%
LOC1410%
B22FWorking metallic powder5%
C22CAlloys5%
G06FElectric digital data processing5%
PatentTitleYear
12,231,382Data processing method and apparatus based on instant messaging, device, and storage medium202511,916,855File commenting method and apparatus, comment viewing method and apparatus, computer device, and storage medium2024D1005267Earphones2023D0991218Headphone202311,478,859Coated tool, and cutting tool including same202211,478,860Coated tool, and cutting tool including same202211,471,948Coated tool and cutting tool including same202211,335,433Feature selection for efficient epistasis modeling for phenotype prediction202211,335,434Feature selection for efficient epistasis modeling for phenotype prediction202211,192,189Coated tool and cutting tool including same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2022Patents assigned to KYOCERA CORP (4)· patent assignee history
2021–2022Based in JP· patent location history
2022Patents assigned to IBM (2)· patent assignee history
2022Based in US· patent location history
2023Patents assigned to DONGGUAN YONGFANG ELECTRONICS TECH CO LTD (2)· patent assignee history
2023–2025Based in CN· patent location history
2024Patents assigned to TENCENT TECH SHENZHEN CO LTD (1)· patent assignee history
2025Patents assigned to TENCENT TECH SHENZHEN COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KYOCERA CORP | 4 | 2021–2022 |
| DONGGUAN YONGFANG ELECTRONICS TECH CO LTD | 2 | 2023 |
| IBM | 2 | 2022 |
| TENCENT TECH SHENZHEN CO LTD | 1 | 2024 |
| TENCENT TECH SHENZHEN COMPANY LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 4 | 2023–2025 |
| JP | 4 | 2021–2022 |
| US | 2 | 2022 |