Inventor

Dan HE

Inventor
CN

Overview

10→
Patents
2021–2025
Patent span
Performing operations
Primary field (CPC B)

Patents· 10 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Bprimary
B23BTurning20%
C23CCoating metallic material20%
B23CMilling15%
G16BBioinformatics, i.e. information and communication technology [ict] specially adapted for genetic or protein-related data processing in computational molecular biology10%
H04LTransmission of digital information, e.g. telegraphic communication10%
LOC1410%
B22FWorking metallic powder5%
C22CAlloys5%
G06FElectric digital data processing5%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to KYOCERA CORP (4)· patent assignee history
2021–2022Based in JP· patent location history
2022Patents assigned to IBM (2)· patent assignee history
2022Based in US· patent location history
2023Patents assigned to DONGGUAN YONGFANG ELECTRONICS TECH CO LTD (2)· patent assignee history
2023–2025Based in CN· patent location history
2024Patents assigned to TENCENT TECH SHENZHEN CO LTD (1)· patent assignee history
2025Patents assigned to TENCENT TECH SHENZHEN COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KYOCERA CORP42021–2022
DONGGUAN YONGFANG ELECTRONICS TECH CO LTD22023
IBM22022
TENCENT TECH SHENZHEN CO LTD12024
TENCENT TECH SHENZHEN COMPANY LTD12025
Locations
LocationPatentsSpan
CN42023–2025
JP42021–2022
US22022