Inventor
JONG YOUN KIM
Inventor
KR
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
12,170,249Semiconductor package including interposer202412,009,277Semiconductor package202411,967,549Semiconductor package202411,710,701Semiconductor package including interposer202311,462,464Fan-out semiconductor package having redistribution line structure202211,404,346Semiconductor package202211,373,980Semiconductor package202211,355,440Semiconductor package including interposer202211,177,205Semiconductor package having multi-level and multi-directional shape narrowing vias2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to SAMSUNG ELECTRONICS CO LTD (9)· patent assignee history
2021–2024Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 9 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 9 | 2021–2024 |