Inventor
Ky-Hyun Jung
Inventor
Cheonan-si, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H05KPrinted circuits25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
G01RMeasuring electric variables13%
PatentTitleYear
8,053,351'Method of forming at least one bonding structure'20118,039,972'Printed circuit board and method thereof and a solder ball land and method thereof'20117,576,438'Printed circuit board and method thereof and a solder ball land and method thereof'20097,102,369'Contact pin, connection device and method of testing'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2011Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history
2006–2011Based in Cheonan-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 4 | 2006–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 4 | 2006–2011 |