Inventor
Kuo-Hao Lee
Inventor
TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices43%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
H01LSemiconductor devices14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
PatentTitleYear
12,283,568Wafer bonding alignment202512,242,181Photomask assembly and method of forming the same202512,130,551Pellicle frame with stress relief trenches202412,054,382Roughness selectivity for MEMS movement stiction reduction202411,789,360Photomask assembly and method of forming the same202311,742,320Wafer bonding alignment202311,726,401Pellicle frame with stress relief trenches202311,655,138Roughness selectivity for MEMS movement stiction reduction202311,415,878Pellicle frame with stress relief trenches202211,392,024Photomask assembly and method of forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 10 | 2022–2025 |