Inventor
Dan R. McCutchan
Inventor
Redwood City, CA, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01RElectrically-conductive connections19%
H05KPrinted circuits19%
Y10TTechnical subjects covered by former us classification19%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
PatentTitleYear
6,506,073'Mounting bracket for integrated circuit device'20036,349,465'Controlled bondline thickness attachment mechanism'20026,164,999'Zero insertion force socket and method for employing same to mount a processor'20006,166,908'Integrated circuit cartridge'20006,002,591'Printed circuit board mounting assembly and a method for mounting an integrated circuit device'19995,980,267'Connector scheme for a power pod power delivery system'19995,956,229'Injection molded thermal interface system'19995,864,478'Power pod/power delivery system'19995,802,707'Controlled bondline thickness attachment mechanism'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2003Patents assigned to INTEL CORP (9)· patent assignee history
1998–2003Based in Redwood City, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 9 | 1998–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Redwood City, California, US | 9 | 1998–2003 |