Inventor
Jui-Hsien Chang
Inventor
Hsinchu County, TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation21%
H01LSemiconductor devices8%
H04NPictorial communication, e.g. television8%
H05KPrinted circuits8%
H10HInorganic light-emitting semiconductor devices having potential barriers8%
G06FElectric digital data processing5%
H10DInorganic electric semiconductor devices5%
A61BDiagnosis3%
H01JElectric discharge tubes or discharge lamps3%
PatentTitleYear
10,881,364Portable carbon nanotube- and filament-type X-ray apparatus202110,756,067Light-emitting device and the method of manufacturing the same202010,217,904Light-emitting device with metallized mounting support structure20199,917,075'Light-emitting device and the method of manufacturing the same'20188,606,987'Data writing method for flash memory and controller using the same'20138,055,873'Data writing method for flash memory, and controller and system using the same'20117,863,105'Image sensor package and forming method of the same'20117,566,854'Image sensor module'20097,525,139'Image sensor with a protection layer'20097,498,556'Image sensor module having build-in package cavity and the method of the same'20097,459,729'Semiconductor image device package with die receiving through-hole and method of the same'20087,423,335'Sensor module package structure and method of the same'20087,416,920'Semiconductor device protective structure and method for fabricating the same'20087,342,296'Wafer street buffer layer'20087,335,870'Method for image sensor protection'20087,279,782'FBGA and COB package structure for image sensor'20077,176,567'Semiconductor device protective structure and method for fabricating the same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2011Patents assigned to ADVANCED CHIP ENG TECH INC (10)· patent assignee history
2007–2011Based in Hsinchu County, TW· patent location history
2008–2020Based in Hsinchu, TW· patent location history
2009Patents assigned to ADAVANCED CHIP ENGINEERING TEC (1)· patent assignee history
2011–2013Patents assigned to PHISON ELECTRONICS CORP (2)· patent assignee history
2011–2013Based in Taipei, TW· patent location history
2013Patents assigned to CHANG JUI-HSIEN (1)· patent assignee history
2018–2020Patents assigned to EPISTAR CORP (3)· patent assignee history
2021Based in Bucheon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED CHIP ENG TECH INC | 10 | 2007–2011 |
| EPISTAR CORP | 3 | 2018–2020 |
| PHISON ELECTRONICS CORP | 2 | 2011–2013 |
| ADAVANCED CHIP ENGINEERING TEC | 1 | 2009 |
| CHANG JUI-HSIENself | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 10 | 2007–2011 |
| Hsinchu, TW | 4 | 2008–2020 |
| Taipei, TW | 2 | 2011–2013 |
| Bucheon-si, KR | 1 | 2021 |