Inventor
SATORU ISHIKAWA
Inventor
JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems10%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters10%
B23KSoldering or unsoldering5%
C22CAlloys5%
H04LTransmission of digital information, e.g. telegraphic communication5%
PatentTitleYear
12,500,201Semiconductor element bonding substrate, semiconductor device, and power conversion device202511,901,326Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device202411,804,414Semiconductor device comprising a lead electrode including a through hole202311,552,875Communication support system and method202311,488,924Semiconductor element bonding substrate, semiconductor device, and power conversion device202211,398,447Semiconductor device and method for producing semiconductor device202211,183,479Semiconductor device, method for manufacturing the same, and power conversion device202111,145,616Semiconductor device, power conversion apparatus, and method for manufacturing semiconductor device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to MITSUBISHI ELECTRIC CORP (7)· patent assignee history
2021–2025Based in JP· patent location history
2023Patents assigned to HITACHI LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 7 | 2021–2025 |
| HITACHI LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 8 | 2021–2025 |