Inventor
Christopher Daniel Manack
Inventor
Flower Mound, TX, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%
B23KSoldering or unsoldering3%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering3%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%
H01BCables3%
PatentTitleYear
11,127,515Nanostructure barrier for copper wire bonding202111,121,076Semiconductor die with conversion coating202111,011,488Zinc-cobalt barrier for interface in solder bond applications202111,011,483Nickel alloy for semiconductor packaging202110,840,211Semiconductor package with leadframe having pre-singulated leads or lead terminals202010,833,036Interconnect for electronic device202010,796,956Contact fabrication to mitigate undercut202010,734,304Plating for thermal management202010,714,417Semiconductor device with electroplated die attach202010,692,830Multilayers of nickel alloys as diffusion barrier layers202010,629,334Nanostructure barrier for copper wire bonding202010,607,931Semiconductor device with electroplated die attach202010,566,267Die attach surface copper layer with protective layer for microelectronic devices202010,453,817Zinc-cobalt barrier for interface in solder bond applications201910,424,552Alloy diffusion barrier layer20199,768,130'Integrated power package'20179,321,631'Method for embedding controlled-cavity MEMS package in integration board'20168,866,237'Methods for embedding controlled-cavity MEMS package in integration board'20147,919,842'Structure and method for sealing cavity of micro-electro-mechanical device'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to TEXAS INSTRUMENTS INC (19)· patent assignee history
2011–2014Based in Lewisville, TX, US· patent location history
2014Patents assigned to KODURI SREENIVASAN K (1)· patent assignee history
2014Patents assigned to MANACK CHRISTOPHER D (1)· patent assignee history
2014Patents assigned to STEPNIAK FRANK (1)· patent assignee history
2016–2017Based in Lantana, TX, US· patent location history
2019–2021Based in Flower Mound, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 19 | 2011–2021 |
| KODURI SREENIVASAN K | 1 | 2014 |
| MANACK CHRISTOPHER Dself | 1 | 2014 |
| STEPNIAK FRANK | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Flower Mound, Texas, US | 15 | 2019–2021 |
| Lantana, Texas, US | 2 | 2016–2017 |
| Lewisville, Texas, US | 2 | 2011–2014 |