Inventor
Ming-Chen Sun
Inventor
Taichung, TW
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices30%
H05KPrinted circuits13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
G06FElectric digital data processing2%
H04NPictorial communication, e.g. television2%
H10KOrganic electric solid-state devices2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
11,003,781Root key processing method and associated device202110,931,957Image decryption apparatus and method of the same202110,141,266Method of fabricating semiconductor package structure201810,096,491Method of fabricating a packaging substrate including a carrier having two carrying portions201810,068,842Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same201810,043,757Semiconductor package structure and method of fabricating the same201810,002,825Method of fabricating package structure with an embedded electronic component20189,905,438'Method of manufacturing package substrate and semiconductor package'20189,899,249'Fabrication method of coreless packaging substrate'20189,735,080'Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same'20179,716,060'Package structure with an embedded electronic component and method of fabricating the package structure'20179,673,140'Package structure having a laminated release layer and method for fabricating the same'20179,640,503'Package substrate, semiconductor package and method of manufacturing the same'20179,510,463'Coreless packaging substrate and fabrication method thereof'20169,490,225'Package structure and fabrication method thereof'20169,112,063'Fabrication method of semiconductor package'20158,796,867'Semiconductor package and fabrication method thereof'20148,471,383'Semiconductor package and fabrication method thereof'20137,453,200'White-light organic light-emitting diode (OLED) and its fabrication method'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008Based in Hsinchu, TW· patent location history
2013–2018Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (16)· patent assignee history
2013–2014Patents assigned to LIN CHUN HSIEN (2)· patent assignee history
2013–2014Patents assigned to PAI YU CHENG (2)· patent assignee history
2013–2014Patents assigned to SUN MING CHEN (2)· patent assignee history
2013–2018Based in Taichung, TW· patent location history
2014Patents assigned to HSIAO WEI CHUNG (1)· patent assignee history
2021Based in Shanghai, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO LTD | 16 | 2013–2018 |
| LIN CHUN HSIEN | 2 | 2013–2014 |
| PAI YU CHENG | 2 | 2013–2014 |
| SUN MING CHENself | 2 | 2013–2014 |
| HSIAO WEI CHUNG | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 16 | 2013–2018 |
| Shanghai, CN | 2 | 2021 |
| Hsinchu, TW | 1 | 2008 |