Inventor

TAKAYUKI SAITO

Inventor
JP

Overview

10→
Patents
2021–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 10 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering8%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables8%
F16LPipes8%
G01BMeasuring length, thickness or similar linear dimensions8%
H04NPictorial communication, e.g. television8%
B05CApparatus for applying fluent materials to surfaces, in general4%
B05DProcesses for applying fluent materials to surfaces, in general4%
B25JManipulators4%
B29CShaping or joining of plastics4%
B60WConjoint control of vehicle sub-units of different type or different function4%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to YOKOHAMA RUBBER CO LTD (3)· patent assignee history
2021–2026Based in JP· patent location history
2022Patents assigned to DENSO WAVE INC (1)· patent assignee history
2023Patents assigned to FUJIFILM BUSINESS INNOVATION CORP (2)· patent assignee history
2025Patents assigned to DEXERIALS CORP (2)· patent assignee history
2026Patents assigned to HITACHI ASTEMO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
YOKOHAMA RUBBER CO LTD32021–2022
DEXERIALS CORP22025
FUJIFILM BUSINESS INNOVATION CORP22023
DENSO WAVE INC12022
HITACHI ASTEMO LTD12026
Locations
LocationPatentsSpan
JP102021–2026