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Inventor

Huang Soon Kang

Inventor
Hsin Chu, TW

Overview

5→
Patents
2012–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing36%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1036%
H01LSemiconductor devices9%
H10DInorganic electric semiconductor devices9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
PatentTitleYear
10,857,649Method and apparatus for performing a polishing process in semiconductor fabrication20209,242,342'Manufacture and method of making the same'20169,102,033'Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process'20158,673,783'Metal conductor chemical mechanical polish'20148,277,286'Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2020Patents assigned to KANG HUANG SOON (5)· patent assignee history
2012–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (4)· patent assignee history
2012Patents assigned to CHERN CHYI-SHYUAN (1)· patent assignee history
2012–2020Based in Hsin Chu, TW· patent location history
2014–2016Patents assigned to LIN CHIN-HSIANG (2)· patent assignee history
2014–2016Patents assigned to YANG CHI-MING (2)· patent assignee history
2014–2016Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KANG HUANG SOONself52012–2020
TAIWAN SEMICONDUCTOR MFG42012–2016
LIN CHIN-HSIANG22014–2016
YANG CHI-MING22014–2016
CHERN CHYI-SHYUAN12012
Locations
LocationPatentsSpan
Hsin Chu, TW32012–2020
Hsinchu, TW22014–2016