Inventor
Ja-Hyung Han
Inventor
Suwon-si, KR
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10DInorganic electric semiconductor devices14%
B24BMachines, devices, or processes for grinding or polishing9%
H01LSemiconductor devices9%
B29CShaping or joining of plastics3%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts3%
B29LIndexing scheme associated with subclass b29c, relating to particular articles3%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for3%
G01SRadio direction-finding3%
PatentTitleYear
11,114,654Negative electrode active material having high output characteristics and lithium secondary battery including the same202110,981,310Method of manufacturing radar transparent cover for vehicles and radar transparent cover manufactured thereby202110,056,458Siloxane and organic-based MOL contact patterning20189,385,192'Shallow trench isolation integration methods and devices formed thereby'20169,123,771'Shallow trench isolation integration methods and devices formed thereby'20157,488,235'Polishing apparatus and related polishing methods'20097,214,123'Retainer ring, Polishing head, and chemical mechanical polishing apparatus'20077,066,785'Polishing apparatus and related polishing methods'20066,924,234'Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper'20056,913,972'Method of fabrication on a gate pattern of a non-volatile memory device'20056,596,581'Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure'20036,475,914'Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2009Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2002–2007Based in Suwon-si, KR· patent location history
2006–2009Based in Gyeonggi-do, KR· patent location history
2015–2018Patents assigned to GLOBALFOUNDRIES INC (3)· patent assignee history
2015–2018Based in Clifton Park, NY, US· patent location history
2021Patents assigned to HYUNDAI MOTOR CO LTD (1)· patent assignee history
2021Patents assigned to KIA MOTORS CORP (1)· patent assignee history
2021Patents assigned to LG CHEMICAL LTD (1)· patent assignee history
2021Based in Daejeon, KR· patent location history
2021Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2002–2009 |
| GLOBALFOUNDRIES INC | 3 | 2015–2018 |
| HYUNDAI MOTOR CO LTD | 1 | 2021 |
| KIA MOTORS CORP | 1 | 2021 |
| LG CHEMICAL LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 5 | 2002–2007 |
| Clifton Park, New York, US | 3 | 2015–2018 |
| Gyeonggi-do, KR | 2 | 2006–2009 |
| Daejeon, KR | 1 | 2021 |
| Seoul, KR | 1 | 2021 |