Inventor
Taichi Obara
Inventor
Tokyo, JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01LSemiconductor devices28%
H05KPrinted circuits12%
B22DCasting of metals4%
H03KPulse technique4%
H10DInorganic electric semiconductor devices4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
10,366,964Semiconductor device having switching elements to prevent overcurrent damage20199,723,718'Electronic component mounting device and semiconductor device including the same'20179,613,888'Semiconductor device and semiconductor module'20179,521,737'Power module'20169,449,910'Stress relief layout for high power semiconductor package'20169,425,065'Semiconductor device and method of manufacture thereof'20169,125,308'Semiconductor device and method of manufacturing thereof'20158,093,692'Semiconductor device packaging including a power semiconductor element'20127,892,893'Semiconductor device and manufacturing method thereof'20117,449,726'Power semiconductor apparatus'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2019Patents assigned to MITSUBISHI ELECTRIC CORP (10)· patent assignee history
2008–2019Based in Tokyo, JP· patent location history
2011–2012Based in Chiyoda-ku, JP· patent location history
2012–2015Patents assigned to OBARA TAICHI (2)· patent assignee history
2015Patents assigned to OKABE HIROYUKI (1)· patent assignee history
2015Patents assigned to YONEYAMA REI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 10 | 2008–2019 |
| OBARA TAICHIself | 2 | 2012–2015 |
| OKABE HIROYUKI | 1 | 2015 |
| YONEYAMA REI | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 8 | 2008–2019 |
| Chiyoda-ku, JP | 2 | 2011–2012 |