Inventor
HONGSIK SHIN
Inventor
KR
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10DInorganic electric semiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B82YSpecific uses or applications of nanostructures14%
PatentTitleYear
12,284,821Semiconductor devices202512,148,701Semiconductor device202412,068,242Semiconductor device and method of fabricating the same202412,034,060Semiconductor device having a ring-shaped protection spacer above a contact pad and enclosing a source/drain contact plug202412,021,146Semiconductor devices202411,948,888Semiconductor device202411,362,196Semiconductor device having a ring-shaped protection spacer enclosing a source/drain contact plug2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2022–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 7 | 2022–2025 |