LexDanaLexDanabeta
Inventor

Hiroyuki Shinozaki

Inventor
Tokyo, JP

Overview

81→
Patents
1995–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 81 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B24BMachines, devices, or processes for grinding or polishing22%
F16CShafts10%
H01LSemiconductor devices9%
C23CCoating metallic material5%
LOC155%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
Y10TTechnical subjects covered by former us classification3%
B08BCleaning in general3%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light3%
PatentTitleYear
11,065,734Film thickness measuring device and polishing device202110,926,374Substrate processing apparatus202110,870,183Substrate processing apparatus202010,777,417Dressing device, polishing apparatus, holder, housing and dressing method202010,688,620Polishing apparatus202010,675,731Method of monitoring a dressing process and polishing apparatus202010,661,409Substrate cleaning apparatus, substrate processing apparatus, and substrate cleaning method202010,636,665Dressing device, polishing apparatus, holder, housing and dressing method202010,625,395Substrate polishing apparatus202010,576,604Substrate polishing apparatus202010,537,975Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus202010,486,285Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method201910,442,054Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body201910,170,345Substrate processing apparatus201910,086,495Dresser disk cleaning brush, cleaning apparatus, and cleaning method201810,032,656Substrate processing apparatus201810,029,343Polishing apparatus201810,016,871Polishing apparatus and controlling the same20189,962,804Polishing apparatus, method for controlling the same, and method for outputting a dressing condition20189,943,943Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus20189,908,212'Polishing table replacement apparatus, polishing table replacement method, and apparatus for replacing a component of semiconductor-device manufacturing machine'20189,849,557Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body20179,808,908'Method of monitoring a dressing process and polishing apparatus'20179,757,838'Polishing apparatus having end point detecting apparatus detecting polishing end point on basis of current and sliding friction'20179,707,661'Polishing method and polishing apparatus'20179,687,957'Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method'20179,687,958'Wet treatment apparatus and substrate treatment apparatus provided with the same'20179,662,761'Polishing apparatus'20179,666,469'Lifting device, substrate processing apparatus having lifting device, and unit transferring method'20179,616,545'Exhaust flow rate control apparatus and substrate processing apparatus provided therewith'20179,550,268'Substrate holding apparatus and polishing apparatus'20179,539,699'Polishing method'20179,511,476'Dresser disk cleaning brush, cleaning apparatus, and cleaning method'2016D0764124'Brush for cleaning semiconductor polishing disk'2016D0760455'Brush for cleaning semiconductor polishing disk'20169,362,129'Polishing apparatus and polishing method'20169,358,662'Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method'2016D0753736'Dresser disk'20169,302,366'Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus'2016D0743455'Dresser disk'2015D0743456'Dresser disk'20159,156,122'Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus'20159,132,525'Polishing apparatus for flattening surface of workpiece'2015D0737873'Dresser disk'2015D0730960'Dressing pellet for dresser disk'2015D0722331'Dressing pellet for dresser disk'20158,807,914'Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber'20148,795,032'Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method'20148,517,796'Dressing apparatus, dressing method, and polishing apparatus'20137,232,286'Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber'20077,134,668'Differential pumping seal apparatus'20067,025,005'Stage device and angle detecting device'20066,809,448'Excimer laser apparatus'20046,809,449'Controlled magnetic bearing apparatus'20046,785,314'Electric discharge gas laser'20046,657,345'Magnetic bearing controller'20036,603,787'Discharge-pumped excimer laser device'20036,570,285'Magnetic bearing apparatus having a protective non-magnetic can'20036,539,043'Discharge-pumped excimer laser device'20036,519,273'Magnetic bearing and circulation fan apparatus'20036,515,387'Controlled magnetic bearing device'20036,464,472'Circulation fan apparatus and circulation-fan driving motor'20026,464,825'Substrate processing apparatus including a magnetically levitated and rotated substrate holder'20026,440,320'Substrate processing method and apparatus'20026,373,159'Substrate rotating apparatus'20026,366,039'Excimer laser device'20026,346,757'Magnetic bearing controller'20026,326,712'Magnetic bearing device'20016,321,463'Substrate treating apparatus and method of operating the same'20016,269,548'Spin processing apparatus'20016,176,929'Thin-film deposition apparatus'20016,022,413'Thin-film vapor deposition apparatus'20005,950,646'Vapor feed supply system'19995,950,925'Reactant gas ejector head'19995,935,337'Thin-film vapor deposition apparatus'19995,757,148'Method of and apparatus for stopping a motor having magnetic bearings'19985,729,736'Access analysis method and system in parallel data base system'19985,728,223'Reactant gas ejector head and thin-film vapor deposition apparatus'19985,641,054'Magnetic levitation conveyor apparatus'19975,601,027'Positioning system with damped magnetic attraction stopping assembly'19975,397,212'Robot with dust-free and maintenance-free actuators'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2021Patents assigned to EBARA CORP (80)· patent assignee history
1995–2003Based in Fujisawa, JP· patent location history
1997–2014Based in Kanagawa, JP· patent location history
1998Patents assigned to HITACHI LTD (1)· patent assignee history
1998Patents assigned to HITACHI SOFTWARE ENG (1)· patent assignee history
2002–2004Patents assigned to KOMATSU MFG CO LTD (3)· patent assignee history
2002–2021Based in Tokyo, JP· patent location history
2013–2015Patents assigned to SHINOZAKI HIROYUKI (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP801995–2021
SHINOZAKI HIROYUKIself42013–2015
KOMATSU MFG CO LTD32002–2004
HITACHI LTD11998
HITACHI SOFTWARE ENG11998
Locations
LocationPatentsSpan
Tokyo, JP542002–2021
Fujisawa, JP141995–2003
Kanagawa, JP131997–2014