Inventor
Yohei Masamori
Inventor
Yokkaichi, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10BElectronic memory devices36%
H10DInorganic electric semiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
PatentTitleYear
11,127,655Memory die containing through-memory-level via structure and methods for making the same202110,381,443Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device201910,115,632Three-dimensional memory device having conductive support structures and method of making thereof201810,020,363Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device20189,985,098Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2021Patents assigned to SANDISK TECHNOLOGIES LLC (5)· patent assignee history
2018–2021Based in Yokkaichi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDISK TECHNOLOGIES LLC | 5 | 2018–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokkaichi, JP | 5 | 2018–2021 |