LexDanaLexDanabeta
Inventor

Hiroyuki Nakanishi

Inventor
Yokohama, JP

Overview

49→
Patents
1994–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 49 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H04NPictorial communication, e.g. television13%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for10%
G02BOptical elements, systems or apparatus6%
H01RElectrically-conductive connections4%
B62DMotor vehicles3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
G06TImage data processing or generation, in general3%
H05KPrinted circuits3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
10,752,200Airbag apparatus202010,647,287Airbag202010,507,781Airbag201910,507,785Airbag201910,507,784Airbag201910,449,155Drug introducing agent for administration into a living body and manufacturing method201910,421,427Occupant protection device201910,279,769Airbag device20199,641,052'Connector of vehicular angled connector-integrated servo motor and production method thereof'20178,940,247'Portable analyzer'20158,887,545'Forging die holder'20148,416,501'Image display apparatus and method of controlling the same'20138,269,353'Semiconductor device having a plurality of adhesion area patterns and one or more non-adhesion area patterns'20128,018,483'Display apparatus, display control apparatus, and control method'20117,728,410'Semiconductor device comprising light-blocking region enclosing semiconductor element'20107,660,044'Image display apparatus and image display method'20107,554,178'Semiconductor device'20097,538,442'Semiconductor chip and semiconductor device'20097,495,751'Measuring apparatus'20097,445,958'Semiconductor device having a leading wiring layer'20087,414,194'Bus bar wiring board and method of assembling the same'20087,282,866'Discharge lamp lighting apparatus'20077,091,616'Semiconductor device having a leading wiring layer'20066,953,370'Connector'20056,940,175'Semiconductor device in which a plurality of electronic components are combined with each other'20056,921,980'Integrated semiconductor circuit including electronic component connected between different component connection portions'20056,838,748'Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof'20056,831,002'Manufacturing method of semiconductor device'20046,784,528'Semiconductor device with plating wiring connecting IC electrode pad to terminal'20046,653,989'Composite display apparatus and head mounted display system using the same'20036,552,426'Semiconductor device and method of manufacturing same'20036,423,102'Jig used for assembling semiconductor devices'20026,396,157'Semiconductor integrated circuit device and manufacturing method thereof'20026,220,404'Non-asbestos disc brake pad for automobiles'20016,118,184'Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow'20006,104,084'Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads'20006,104,507'Image display apparatus having a communication function'20006,072,243'Semiconductor integrated circuit device capable of surely electrically insulating two semiconductor chips from each other and fabricating method thereof'20005,872,637'Image communication system'19995,867,563'Location display apparatus'19995,793,108'Semiconductor integrated circuit having a plurality of semiconductor chips'19985,761,394'Color image communication apparatus and method having two modes'19985,715,332'Image transmission method, and apparatus therefor'19985,644,407'Image processing apparatus having a remote communication function'19975,561,536'Color image communication apparatus and method'19965,483,358'Color image communication apparatus and method'19965,473,189'Lead frame for a semiconductor integrated circuit with outer leads having a staggered configuration'19955,402,255'Liquid crystal panel module and tape carrier package for liquid crystal driver IC'19955,369,505'Image processing apparatus'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2013Patents assigned to CANON KK (12)· patent assignee history
1994–2013Based in Yokohama, JP· patent location history
1995–2012Patents assigned to SHARP KK (18)· patent assignee history
1995–2002Based in Tenri, JP· patent location history
2000–2005Based in Kitakatsuragi-gun, JP· patent location history
2009–2015Patents assigned to ARKRAY INC (2)· patent assignee history
2012–2015Patents assigned to NAKANISHI HIROYUKI (4)· patent assignee history
2012–2019Based in Osaka, JP· patent location history
2019–2020Patents assigned to TOYODA GOSEI KK (7)· patent assignee history
2019–2020Based in Kiyosu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHARP KK181995–2012
CANON KK121994–2013
TOYODA GOSEI KK72019–2020
NAKANISHI HIROYUKIself42012–2015
ARKRAY INC22009–2015
Locations
LocationPatentsSpan
Yokohama, JP111994–2013
Kiyosu, JP72019–2020
Kitakatsuragi-gun, JP72000–2005
Tenri, JP41995–2002
Osaka, JP32012–2019