Inventor
Naoto Hosotani
Inventor
Osaka, JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
Y10TTechnical subjects covered by former us classification14%
B23KSoldering or unsoldering9%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy5%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
G06TImage data processing or generation, in general2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
9,548,477'Battery block'20178,835,032'Battery module'20147,938,929'Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components'20117,490,652'Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components'20097,357,288'Component connecting apparatus'20087,076,867'Pressurizing method'20066,995,342'Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus'20066,839,959'Component mounting apparatus'20056,797,926'Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus'20046,561,408'Bonding head and component mounting apparatus'20036,544,377'Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components'20036,506,222'Method and apparatus for mounting component'20036,264,704'Method and apparatus for mounting component'20016,246,789'Component mounting apparatus and method'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (10)· patent assignee history
2001–2017Based in Osaka, JP· patent location history
2009–2014Patents assigned to PANASONIC CORP (3)· patent assignee history
2014–2017Patents assigned to ASAIDA YASUHIRO (2)· patent assignee history
2014–2017Patents assigned to HOSOTANI NAOTO (2)· patent assignee history
2014Patents assigned to EJIMA TSUNEYUKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 10 | 2001–2008 |
| PANASONIC CORP | 3 | 2009–2014 |
| ASAIDA YASUHIRO | 2 | 2014–2017 |
| HOSOTANI NAOTOself | 2 | 2014–2017 |
| EJIMA TSUNEYUKI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 14 | 2001–2017 |