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Inventor

Sih Fei Lim

Inventor
Penang, MY

Overview

3→
Patents
2012–2016
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H01LSemiconductor devices25%
PatentTitleYear
9,397,016'Flip chip assembly process for ultra thin substrate and package on package assembly'20168,847,368'Flip chip assembly process for ultra thin substrate and package on package assembly'20148,258,019'Flip chip assembly process for ultra thin substrate and package on package assembly'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2016Patents assigned to INTEL CORP (3)· patent assignee history
2012–2014Patents assigned to LIM BOK SIM (2)· patent assignee history
2012–2014Patents assigned to LIM SIH FEI (2)· patent assignee history
2012–2014Patents assigned to LOKE MUN LEONG (2)· patent assignee history
2012–2014Patents assigned to MONG WENG KHOON (2)· patent assignee history
2012–2014Based in Penang, MY· patent location history
2016Based in Bukit Mertajasu, MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP32012–2016
LIM BOK SIM22012–2014
LIM SIH FEIself22012–2014
LOKE MUN LEONG22012–2014
MONG WENG KHOON22012–2014
Locations
LocationPatentsSpan
Penang, MY22012–2014
Bukit Mertajasu, MY12016