Inventor
William C. Allison
Inventor
Beaverton, OR, US
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing33%
B24DTools for grinding, buffing or sharpening24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
B41MPrinting, duplicating, marking, or copying processes3%
C08JWorking-up3%
Y10TTechnical subjects covered by former us classification3%
A61KPreparations for medical, dental or toiletry purposes2%
C11DDetergent compositions2%
A61QSpecific use of cosmetics or similar toiletry preparations1%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool1%
PatentTitleYear
10,946,495Low density polishing pad202110,293,459Polishing pad having polishing surface with continuous protrusions201910,160,092Polishing pad having polishing surface with continuous protrusions having tapered sidewalls20189,931,728Polishing pad with foundation layer and polishing surface layer20189,931,729Polishing pad with grooved foundation layer and polishing surface layer20189,868,185'Polishing pad with foundation layer and window attached thereto'20189,649,742'Polishing pad having polishing surface with continuous protrusions'20179,597,777'Homogeneous polishing pad for eddy current end-point detection'20179,597,769'Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer'20179,597,770'Method of fabricating a polishing'20179,555,518'Polishing pad with multi-modal distribution of pore diameters'20179,333,577'Electro discharge machining apparatus and method'20169,296,085'Polishing pad with homogeneous body having discrete protrusions thereon'20169,249,273'Polishing pad with alignment feature'20169,238,294'Polishing pad having porogens with liquid filler'20169,211,628'Polishing pad with concentric or approximately concentric polygon groove pattern'20159,156,124'Soft polishing pad for polishing a semiconductor substrate'20159,067,298'Polishing pad with grooved foundation layer and polishing surface layer'20159,067,297'Polishing pad with foundation layer and polishing surface layer'20159,028,302'Polishing pad for eddy current end-point detection'20159,017,140'CMP pad with local area transparency'20158,968,058'Polishing pad with alignment feature'20158,920,219'Polishing pad with alignment aperture'20148,702,479'Polishing pad with multi-modal distribution of pore diameters'20148,657,653'Homogeneous polishing pad for eddy current end-point detection'20148,628,384'Polishing pad for eddy current end-point detection'20148,439,994'Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection'20137,291,063'Polyurethane urea polishing pad'20077,097,549'Polishing pad'20066,905,402'Polishing pad for planarization'20056,340,725'Inkjet printing media'20026,228,822'Synthetic detergent base material and synthetic detergent bar produced therefrom'20016,074,761'Inkjet printing media'20005,948,396'Hair fixative amphoteric polymer composition'19995,880,196'Inkjet printing media'19995,075,042'Surfactant blend containing an alkyl poly(ethyleneoxy)sulfonate to reduce dermal irritation'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991Based in Uniontown, OH, US· patent location history
1999–2007Based in Murrysville, PA, US· patent location history
2013–2021Patents assigned to NEXPLANAR CORP (25)· patent assignee history
2013–2017Patents assigned to SCOTT DIANE (15)· patent assignee history
2013–2017Patents assigned to ALLISON WILLIAM C (14)· patent assignee history
2013–2017Patents assigned to HUANG PING (9)· patent assignee history
2013–2016Patents assigned to FRENTZEL RICHARD (7)· patent assignee history
2013–2021Based in Beaverton, OR, US· patent location history
2016Based in West Chester, OH, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEXPLANAR CORP | 25 | 2013–2021 |
| SCOTT DIANE | 15 | 2013–2017 |
| ALLISON WILLIAM Cself | 14 | 2013–2017 |
| HUANG PING | 9 | 2013–2017 |
| FRENTZEL RICHARD | 7 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beaverton, OR, US | 26 | 2013–2021 |
| Murrysville, Pennsylvania, US | 8 | 1999–2007 |
| West Chester, OH, US | 1 | 2016 |
| Uniontown, OH, US | 1 | 1991 |