Inventor
CHUN-CHIH LIN
Inventor
TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H01LSemiconductor devices23%
H10DInorganic electric semiconductor devices8%
B08BCleaning in general4%
H10BElectronic memory devices4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
B05BSpraying apparatus3%
F16PSafety devices in general3%
F23JRemoval or treatment of combustion products or combustion residues3%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace3%
PatentTitleYear
12,363,985Fluorine-free interface for semiconductor device performance gain202512,362,095Method for producing magnetic device202512,230,517Exhaust system and process equipment202512,142,664Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrode202412,094,648Method for producing a magnetic device202412,059,692Nozzle assembly for use with liquid dispensing system202412,048,944Method of operating drippage prevention system202412,040,293Redistribution layer metallic structure and method202411,908,909Fluorine-free interface for semiconductor device performance gain202411,823,919Multi-shield plate and control system202311,741,149Server storage management system capable of generating rack location map202311,642,682Pipe design for prevent drip202311,502,050Redistribution layer metallic structure and method202211,437,477Fluorine-free interface for semiconductor device performance gain202211,396,695Electromagnetic module for physical vapor deposition202211,398,393Vapor shield replacement system and method202211,387,123Metrology method in wafer transportation202211,381,129Motor stator with winding configuration using hairpin wires202211,348,811Thermal chamber exhaust structure and method202211,222,788Methods of enhancing surface topography on a substrate for inspection202211,177,365Semiconductor device with adhesion layer202111,164,957Semiconductor device with adhesion layer and method of making2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (18)· patent assignee history
2021–2025Based in TW· patent location history
2022Patents assigned to DELTA ELECTRONICS INC (1)· patent assignee history
2023Patents assigned to WISTRON CORP (1)· patent assignee history
2024–2025Patents assigned to CHILISIN ELECTRONICS CORP (2)· patent assignee history
2024Patents assigned to TAIWAN SEMICONDUCOTR MFG COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 18 | 2021–2025 |
| CHILISIN ELECTRONICS CORP | 2 | 2024–2025 |
| DELTA ELECTRONICS INC | 1 | 2022 |
| TAIWAN SEMICONDUCOTR MFG COMPANY LTD | 1 | 2024 |
| WISTRON CORP | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 22 | 2021–2025 |