Inventor
Chan-Suk Lee
Inventor
Chungcheongnam-do, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
B42DBooks10%
H05KPrinted circuits10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y02PClimate change mitigation technologies in the production or processing of goods10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
7,485,959'Structure for joining a semiconductor package to a substrate using a solder column'20097,414,303'Lead on chip semiconductor package'20087,199,458'Stacked offset semiconductor package and method for fabricating'20076,984,877'Bumped chip carrier package using lead frame and method for manufacturing the same'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2009Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history
2006–2009Based in Chungcheongnam-do, KR· patent location history
2007Based in Cheonan-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 4 | 2006–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chungcheongnam-do, KR | 3 | 2006–2009 |
| Cheonan-si, KR | 1 | 2007 |