Inventor
Rick Snyder
Inventor
Windsor, CO, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H01LSemiconductor devices33%
H10DInorganic electric semiconductor devices17%
H03HImpedance networks, e.g. resonant circuits8%
PatentTitleYear
9,576,920'Moisture barrier for semiconductor structures with stress relief'20179,508,661'Moisture barrier for semiconductor structures with stress relief'20169,087,926'Low capacitance semiconductor device'20158,946,877'Semiconductor package including cap'20158,587,391'Acoustic coupling layer for coupled resonator filters and method of fabricating acoustic coupling layer'20137,977,799'Planar packageless semiconductor structure with via and coplanar contacts'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011Patents assigned to AVAGO TECHNOLOGIES WIRELESS IP (1)· patent assignee history
2011–2017Based in Windsor, CO, US· patent location history
2013–2017Patents assigned to AVAGO TECHNOLOGIES GENERAL IP (5)· patent assignee history
2013–2015Patents assigned to SNYDER RICK (2)· patent assignee history
2013Patents assigned to GILBERT STEVE (1)· patent assignee history
2013Patents assigned to LARSON III JOHN D (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVAGO TECHNOLOGIES GENERAL IP | 5 | 2013–2017 |
| SNYDER RICKself | 2 | 2013–2015 |
| AVAGO TECHNOLOGIES WIRELESS IP | 1 | 2011 |
| GILBERT STEVE | 1 | 2013 |
| LARSON III JOHN D | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Windsor, CO, US | 6 | 2011–2017 |