Inventor

Michael J. Berman

Inventor
West Linn, OR, US

Overview

96→
Patents
1987–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 96 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y10TTechnical subjects covered by former us classification5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
G05BControl or regulating systems in general5%
A61BDiagnosis4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
A61FFilters implantable into blood vessels4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
A45DHairdressing or shaving equipment3%
PatentTitleYear
11,048,224Computerized system and method for generating an undesirable chatter free milling CNC program for use in machining a workpiece202110,862,920Systems and methods for dynamic network security control and configuration202010,620,607Computerized tool path generation202010,571,162Integration of distributed thermoelectric heating and cooling202010,416,648Computerized system and method for generating an undesirable chatter free milling CNC program for use in machining a workpiece201910,356,121Systems and methods for dynamic network security control and configuration201910,324,445Object fabricated from a workpiece machined using a computer controlled machine tool along an asymmetric spiral tool path20199,823,645'Computerized tool path generation'20179,749,351'Systems and methods for dynamic network security control and configuration'20179,690,282'Computerized tool path generation'20179,638,442'Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling'20179,596,944'Integration of distributed thermoelectric heating and cooling'20179,509,660'Systems and methods for dynamic network security control and configuration'20169,088,541'Systems and methods for dynamic network security control and configuration'20159,052,704'Computerized tool path generation'20158,653,357'Method for heat dissipation on semiconductor device'20148,489,224'Computerized tool path generation'20138,430,845'Emboli protection devices and related methods of use'20138,404,960'Method for heat dissipation on semiconductor device'20138,034,023'Emboli protection devices and related methods of use'20117,959,603'Emboli protection devices and related methods of use'20117,867,216'Emboli protection device and related methods of use'20117,797,053'Lead stabilization devices and methods'20107,751,609'Determination of film thickness during chemical mechanical polishing'20107,654,978'Emboli protection devices and related methods of use'20107,610,919'Intraoral aversion devices and methods'20097,442,113'Visual wear confirmation polishing pad'20087,422,579'Emboli protection devices and related methods of use'20087,381,502'Apparatus and method to improve the resolution of photolithography systems by improving the temperature stability of the reticle'20087,332,062'Electroplating tool for semiconductor manufacture having electric field control'20087,298,458'Optical error minimization in a semiconductor manufacturing apparatus'20077,198,546'Method to monitor pad wear in CMP processing'20077,183,787'Contact resistance device for improved process control'20077,135,006'Finger positioner'20067,098,996'Optical error minimization in a semiconductor manufacturing apparatus'20067,081,037'Pad conditioner setup'20067,067,048'Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bath'20067,023,530'Dual source lithography for direct write application'20066,982,206'Mechanism for improving the structural integrity of low-k films'20066,979,251'Method and apparatus to add slurry to a polishing system'20056,971,944'Method and control system for improving CMP process by detecting and reacting to harmonic oscillation'2005D0511564'Faucet'2005D0511563'Faucet'20056,943,055'Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer'20056,927,177'Chemical mechanical electropolishing system'20056,917,430'Method to improve the control of source chemicals delivery by a carrier gas'20056,898,064'System and method for optimizing the electrostatic removal of a workpiece from a chuck'20056,894,762'Dual source lithography for direct write application'20056,885,436'Optical error minimization in a semiconductor manufacturing apparatus'20056,874,510'Method to use a laser to perform the edge clean operation on a semiconductor wafer'20056,869,893'Laminate low K film'20056,866,970'Apparatus and method to improve the resolution of photolithography systems by improving the temperature stability of the reticle'20056,849,936'System and method for using film deposition techniques to provide an antenna within an integrated circuit package'20056,837,967'Method and apparatus for cleaning deposited films from the edge of a wafer'20056,831,022'Method and apparatus for removing water vapor as a byproduct of chemical reaction in a wafer processing chamber'2004D0495033'Faucet'2004D0495034'Faucet'20046,764,749'Method to improve the resolution of a photolithography system by use of a coupling layer between the photo resist and the ARC'20046,743,979'Bonding pad isolation'20046,743,701'Method for the formation of active area utilizing reverse trench isolation'20046,739,953'Mechanical stress free processing method'20046,722,948'Pad conditioning monitor'20046,691,872'Method of making a cosmetic sampler using bulk thin film application techniques'20046,630,411'Method and apparatus for removing water vapor as a byproduct of chemical reaction in a wafer processing chamber'20036,627,466'Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer'20036,575,907'Determination of fetal weight in utero'20036,464,566'Apparatus and method for linearly planarizing a surface of a semiconductor wafer'20026,434,260'Facial imaging in utero'20026,375,550'Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer'20026,375,616'Automatic fetal weight determination'20026,347,291'Substrate position location system'20026,315,724'3-dimensional ultrasonic imaging'20016,297,558'Slurry filling a recess formed during semiconductor fabrication'20016,273,798'Pre-conditioning polishing pads for chemical-mechanical polishing'20016,234,883'Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing'20016,223,503'Hot pour product sampler and method of making using bulk thin film application techniques'20016,182,420'Method of making a cosmetic sampler using bulk thin film application techniques'20016,108,093'Automated inspection system for residual metal after chemical-mechanical polishing'20006,070,392'Hot pour product sampler and method of making using bulk thin film application techniques'20006,069,085'Slurry filling a recess formed during semiconductor fabrication'20005,990,789'System and method for preventing smoke and fire damage to people and equipment in a clean room area from a fire'19995,990,010'Pre-conditioning polishing pads for chemical-mechanical polishing'19995,985,679'Automated endpoint detection system during chemical-mechanical polishing'19995,957,757'Conditioning CMP polishing pad using a high pressure fluid'19995,953,885'Cosmetic sampler and method of making using bulk thin film application techniques'19995,893,756'Use of ethylene glycol as a corrosion inhibitor during cleaning after metal chemical mechanical polishing'19995,885,701'Odorant composition delivery system and method'19995,882,251'Chemical mechanical polishing pad slurry distribution grooves'19995,835,226'Method for determining optical constants prior to film processing to be used improve accuracy of post-processing thickness measurements'19985,637,401'Odorant composition, delivery system and method'19975,589,260'Method and apparatus for producing plastic products'19965,298,966'Measurement system'19945,156,700'Method and apparatus for making three-dimensional objects'19925,091,861'System for automatic finishing of machine parts'19925,071,503'Method and apparatus for making three-dimensional objects'19914,653,114'Automatic terminal signal equalization'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–2021Based in Kfar Yona, IL· patent location history
1997–2004Based in Southampton, PA, US· patent location history
1998–2010Patents assigned to LSI LOGIC CORP (46)· patent assignee history
1999–2013Based in West Linn, OR, US· patent location history
2003–2008Based in Portland, OR, US· patent location history
2005–2013Patents assigned to BERMAN MICHAEL (4)· patent assignee history
2008–2013Patents assigned to ST JUDE MEDICAL CARDIOLOGY DIV (6)· patent assignee history
2008–2013Based in Minnetonka, MN, US· patent location history
2013–2021Patents assigned to SOLIDCAM LTD (8)· patent assignee history
2015–2020Patents assigned to CATBIRD NETWORKS INC (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LSI LOGIC CORP461998–2010
SOLIDCAM LTD82013–2021
ST JUDE MEDICAL CARDIOLOGY DIV62008–2013
CATBIRD NETWORKS INC52015–2020
BERMAN MICHAELself42005–2013
Locations
LocationPatentsSpan
West Linn, OR, US371999–2013
Kfar Yona, IL101992–2021
Portland, OR, US102003–2008
Minnetonka, Minnesota, US82008–2013
Southampton, Pennsylvania, US61997–2004