Inventor
Yian-Liang Kuo
Inventor
Toufen Township, TW
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
G01RMeasuring electric variables3%
G06FElectric digital data processing3%
H04WWireless communication networks3%
B23KSoldering or unsoldering1%
G01NInvestigating or analysing materials by determining their chemical or physical properties1%
G02BOptical elements, systems or apparatus1%
G06KGraphical data reading1%
PatentTitleYear
10,993,078Tracking system for tracking and rendering virtual object corresponding to physical object and the operating method for the same202110,917,827Communication system and head mounted display202110,890,541Gas detection apparatus202110,867,975Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices202010,770,366Integrated circuit packages and methods for forming the same202010,510,635Integrated circuit packages and methods for forming the same201910,453,818Packaging structures of integrated circuits201910,340,258Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices201910,269,750Methods and apparatus of packaging semiconductor devices201910,056,312Integrated circuit packages and methods for forming the same20189,780,009'Integrated circuit packages and methods for forming the same'20179,659,890'Methods and apparatus of packaging semiconductor devices'20179,620,414'Protecting flip-chip package using pre-applied fillet'20179,196,532'Integrated circuit packages and methods for forming the same'20159,136,235'Methods and apparatus of packaging semiconductor devices'20159,064,881'Protecting flip-chip package using pre-applied fillet'20159,059,158'Semiconductor device having under-bump metallization (UBM) structure and method of forming the same'20159,053,943'Bond pad design for improved routing and reduced package stress'20158,994,155'Packaging devices, methods of manufacture thereof, and packaging methods'20158,846,548'Post-passivation interconnect structure and methods for forming the same'20148,803,338'Semiconductor device having under-bump metallization (UBM) structure and method of forming the same'20148,580,657'Protecting sidewalls of semiconductor chips using insulation films'20138,581,420'Under-bump metallization (UBM) structure and method of forming the same'20138,581,399'Metal bump structure'20138,569,886'Methods and apparatus of under bump metallization in packaging semiconductor devices'20138,507,316'Protecting T-contacts of chip scale packages from moisture'20138,308,052'Thermal gradient reflow for forming columnar grain structures for solder bumps'20127,439,751'Apparatus and method for testing conductive bumps'20087,372,153'Integrated circuit package bond pad having plurality of conductive members'20087,180,173'Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)'20077,102,372'Apparatus and method for testing conductive bumps'20067,081,209'Solder mask removal method'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2015Patents assigned to TAIWAN SEMICONDUCTOR MFG (19)· patent assignee history
2006–2020Based in Hsinchu, TW· patent location history
2006Based in Hsin Chu, TW· patent location history
2012–2015Patents assigned to KUO YIAN-LIANG (9)· patent assignee history
2012–2015Patents assigned to TSAI TSUNG-FU (6)· patent assignee history
2012–2019Based in Toufen Township, TW· patent location history
2015Based in Miao-Li County, TW· patent location history
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2021Patents assigned to HTC CORP (3)· patent assignee history
2021Based in Taoyuan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 19 | 2006–2015 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2017–2020 |
| KUO YIAN-LIANGself | 9 | 2012–2015 |
| TSAI TSUNG-FU | 6 | 2012–2015 |
| HTC CORP | 3 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toufen Township, TW | 15 | 2012–2019 |
| Hsinchu, TW | 12 | 2006–2020 |
| Taoyuan, TW | 3 | 2021 |
| Miao-Li County, TW | 1 | 2015 |
| Hsin Chu, TW | 1 | 2006 |