Inventor
Kazuhiro Miura
Inventor
Osaka, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y10TTechnical subjects covered by former us classification9%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
H01LSemiconductor devices7%
H10KOrganic electric solid-state devices7%
B29CShaping or joining of plastics4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
10,450,039Non-spherical tank and liquefied gas carrier ship equipped with the non-spherical tanks20199,520,564'Photoelectric conversion material, method for producing the same, and organic photovoltaic cell containing the same'20169,276,213'Photoelectric conversion material, method for producing the same, and organic photovoltaic cell containing the same'20169,263,688'Photoelectric conversion material, method for producing the same, and organic photovoltaic cell containing the same'20169,257,652'Photoelectric conversion material, method for producing the same, and organic photovoltaic cell containing the same'20169,145,468'Photoelectric conversion material, method for producing the same, and organic photovoltaic cell containing the same'20159,007,330'Touch panel including a wiring substrate disposed between a pair of substrates and a method for producing the same'20158,264,469'Touch panel and display unit'20127,914,941'Solid oxide fuel cell and manufacturing method thereof'20117,485,678'Process for producing carbon nanotube reinforced composite material'20097,101,171'Molding die for disc substrate'20066,866,500'Clamping apparatus'20056,846,375'Method of manufacturing multilayer ceramic wiring board and conductive paste for use'20056,514,364'Manufacturing method of wiring board, and conductive paste used therein'20036,372,158'Conductive paste'20026,347,584'Method of manufacturing electronic components using intaglio plate having dual releasing layers'20026,141,847'Method of manufacturing composite electronic component'20006,129,849'Process for accelerating reaction of ozone with AM catalyst'20005,688,441'Thixotropic conductive paste'19975,662,755'Method of making multi-layered ceramic substrates'19975,547,530'Method of manufacturing a ceramic substrate'19965,525,402'Ceramic substrate and manufacturing method thereof'19965,503,777'Thixotropic conductive paste'19965,496,619'Assembly formed from conductive paste and insulating paste'19965,407,473'Conductive ink'19955,370,759'Method for producing multilayered ceramic substrate'19945,227,113'Process for the high speed production of fiber reinforced plastic'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2016Patents assigned to HONDA MOTOR CO LTD (7)· patent assignee history
1993–2019Based in Tokyo, JP· patent location history
1994–2005Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (13)· patent assignee history
1994–2011Based in Osaka, JP· patent location history
2000–2011Patents assigned to KANSAI ELECTRIC POWER CO (2)· patent assignee history
2005–2015Patents assigned to SONY CORP (3)· patent assignee history
2005–2006Based in Shizuoka, JP· patent location history
2009–2016Based in Wako, JP· patent location history
2012–2015Patents assigned to KIMURA KIYOHIRO (2)· patent assignee history
2012–2015Based in Miyagi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 13 | 1994–2005 |
| HONDA MOTOR CO LTD | 7 | 1993–2016 |
| SONY CORP | 3 | 2005–2015 |
| KANSAI ELECTRIC POWER CO | 2 | 2000–2011 |
| KIMURA KIYOHIRO | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 15 | 1994–2011 |
| Wako, JP | 6 | 2009–2016 |
| Tokyo, JP | 2 | 1993–2019 |
| Miyagi, JP | 2 | 2012–2015 |
| Shizuoka, JP | 2 | 2005–2006 |