Inventor
Cheol-Joon Yoo
Inventor
Cheonan-si, KR
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
B08BCleaning in general4%
B29CShaping or joining of plastics4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
B42DBooks4%
H05KPrinted circuits4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
7,939,924'Stack type ball grid array package and method for manufacturing the same'20117,485,959'Structure for joining a semiconductor package to a substrate using a solder column'20097,465,142'Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape'20087,298,033'Stack type ball grid array package and method for manufacturing the same'20077,284,941'Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape'20077,279,360'Semiconductor device and method of packaging the same'20077,170,158'Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture'20077,129,118'Protective tape removing apparatus and method of assembling semiconductor package using the same'20067,129,585'Semiconductor device and method of packaging the same'20066,869,264'Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape'20056,808,379'Cleaner for molding apparatus of semiconductor chip packages'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2011Patents assigned to SAMSUNG ELECTRONICS CO LTD (11)· patent assignee history
2004–2011Based in Cheonan-si, KR· patent location history
2006–2009Based in Chungcheongnam-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 11 | 2004–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 8 | 2004–2011 |
| Chungcheongnam-do, KR | 3 | 2006–2009 |