Inventor
BRANDON MARIN
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
G02BOptical elements, systems or apparatus14%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
H01FMagnets5%
H05KPrinted circuits5%
H10DInorganic electric semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,449,600Position controlled waveguides and methods of manufacturing the same202512,444,672Hybrid bonding technologies with thermal expansion compensation structures202512,394,719Methods and apparatus to increase glass core thickness202512,313,890Through-substrate optical vias202512,253,722Magneto-optical Kerr effect interconnects for photonic packaging202512,255,147Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein202512,224,103Angled inductor with small form factor202512,074,102Structural elements for application specific electronic device packages202412,033,930Selectively roughened copper architectures for low insertion loss conductive features202411,804,420Core-shell particles for magnetic packaging2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to INTEL CORP (10)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 10 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2023–2025 |