Inventor
Kenneth Lin
Inventor
Hsinchu, TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H04NPictorial communication, e.g. television20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
6,756,184'Method of making tall flip chip bumps'20046,534,396'Patterned conductor layer pasivation method with dimensionally stabilized planarization'20036,319,846'Method for removing solder bodies from a semiconductor wafer'20015,475,615'Method and system for sizing interactive video delivery systems'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995Patents assigned to US WEST ADVANCED TECH INC (1)· patent assignee history
1995Based in Boulder, CO, US· patent location history
2001–2004Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2001–2004Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 3 | 2001–2004 |
| US WEST ADVANCED TECH INC | 1 | 1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 3 | 2001–2004 |
| Boulder, CO, US | 1 | 1995 |