Inventor

TIENTEH CHEN

Inventor
US

Overview

21→
Patents
2021–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics15%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering15%
B22FWorking metallic powder12%
Y02PClimate change mitigation technologies in the production or processing of goods12%
C09DCoating compositions, e.g. paints, varnishes or lacquers10%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts7%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
C08LCompositions of macromolecular compounds5%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (16)· patent assignee history
2021–2026Based in US· patent location history
2025–2026Patents assigned to PERIDOT PRINT LLC (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO162021–2025
PERIDOT PRINT LLC52025–2026
Locations
LocationPatentsSpan
US212021–2026