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Inventor

Qian Deng

Inventor
Shenzhen, CN

Overview

3→
Patents
2013–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Qprimary
H04QSelecting22%
B29CShaping or joining of plastics11%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts11%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form11%
C08LCompositions of macromolecular compounds11%
C09JAdhesives11%
H01RElectrically-conductive connections11%
H04LTransmission of digital information, e.g. telegraphic communication11%
PatentTitleYear
10,414,139Adhesive compositions and multilayered structures comprising functionalized polypropylene20198,861,222'Backplane, communication device and communication system'20148,570,764'Backplane and backplane communication system'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2014Patents assigned to HUAWEI TECH CO LTD (2)· patent assignee history
2013Patents assigned to CAO MEIHAN (1)· patent assignee history
2013Patents assigned to DENG QIAN (1)· patent assignee history
2013Patents assigned to DENG ZHIGAO (1)· patent assignee history
2013–2014Based in Shenzhen, CN· patent location history
2019Patents assigned to DU PONT (1)· patent assignee history
2019Based in Kingston, CA· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUAWEI TECH CO LTD22013–2014
CAO MEIHAN12013
DENG QIANself12013
DENG ZHIGAO12013
DU PONT12019
Locations
LocationPatentsSpan
Shenzhen, CN22013–2014
Kingston, CA12019